EDA solutions for Heterogeneous Integration and Advanced Packaging Technologies

Meeting & Discussion

Technology Introduction:
This project develops an EDA tool chain for advanced packaging designs. From the system performance evaluation, full-chip thermal simulation and timing analysis, to the physical design for chip-package co-optimization, we all have plans to solve the design bottleneck. Finally, those solutions will be integrated to ITRI's open EDA platform to help local industry deal with advanced packaging issues.
Industry Applicability:
Advanced packaging is key to boosting chip performance, but EDA tools are dominated by global companies, limiting local innovation. To address new design challenges, we integrate academic EDA research to develop tool chain for next-gen chip design, build local EDA design flow, and use ITRI's open EDA platform to help companies adopt these tools and successfully develop advanced packaging products.

National Yang Ming Chiao Tung University

National Yang Ming Chiao Tung University (NYCU) was formed in 2021 through the merger of National Yang Ming University and National Chiao Tung University. Located in Hsinchu, Taiwan, NYCU is a leading institution specializing in technology, engineering, medicine, and social sciences. The university is known for its strengths in research and innovation, particularly in areas such as information technology, biomedicine, and artificial intelligence. NYCU fosters interdisciplinary collaboration, global partnerships, and aims to nurture professionals with strong academic foundations and leadership skills to address societal challenges and contribute to technological advancements.