Low Warpage Double Side Panel Level RDL with Fine Line Trace
Technology Introduction:
(1)Development of key technologies for panel-level interposers based on FOPLP technology.(2)Development of patterning processes for 3D interconnected structures.
(3)Warpage control for double-sided interposer structures.
Industrial Applications:
In response to the future requirements for high-speed IC computing, a low-warp, high-resolution panel-level packaging (PLP) double-sided RDL (Redistribution Layer) technology is being developed. Based on the existing single-sided process flows used by packaging and panel manufacturers, a large-size, low-warp double-sided RDL (37 x 47 cm²) is being created, incorporating panel-level copper pillar processes to electrically connect the upper and lower RDL layers. Additionally, high-resolution circuitry (3μm) can also be applied to chip-first IC packaging for chip displacement compensation within the RDL, making it suitable for panel-level interposers required in advanced packaging technologies.
Industrial Technology Research Institute
ITRI is a world-leading applied technology research institute with more than 6,500 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation Corp., and Taiwan Biomaterial Co.
Contact Information
Name：Gary Wu
Tel：03-591-3685
Address：No. 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu County 310401, Taiwan (R.O.C.)
