The aim of this project is to develop Advanced High-Density Monolithic Three Dimensional Integrated Circuits with Multi-stacked Transistor Layers by integrating three layers of high-performance stacked transistors and extending them to the circuit design of application-specific integrated circuits (ASICs). The research contents include the developments of novel semiconductor materials, high-performance GAAFET devices, the device model establishment, and circuit designs for ASICs. Based on the device models of three-layer stacked transistors, the driver IC design of augmented reality telescopes with image sensors and micro-LED display circuits is realized to demonstrate the technology feasibility of the proposed M3D-ICs.